The process of PCB SMT surface mount
The PCB SMT surface mount process consists of three main steps, solder paste printing, component placement, and reflow soldering. 1. Solder paste printing The solder […]
The PCB SMT surface mount process consists of three main steps, solder paste printing, component placement, and reflow soldering. 1. Solder paste printing The solder […]
1.Prevent the substrate from being warped due to improper inventory (1)Due to the increase in warpage of the copper clad laminate during storage, the moisture […]
PCB surface treatment technology refers to form a layer that it is different from the mechanical, physical and chemical properties of the substrate on PCB […]
In the process of PCBA smt, the solder joint quality of pcba board is very important. The solder joint quality will not only affect the […]
A variety of undesirable phenomena and production defects often occur in SMT chip processing, and many of these defects are caused by solder paste problems […]
OSP is the abbreviation of Organic Solderability Preservatives. Simply put, OSP is a chemical method to grow an organic film on a clean bare copper […]
In SMT processing of electronic plants, there is an indispensable device to ensure PCBA processing quality, that is, AOI automatic optical inspection equipment. At present, […]
PCBA processing belongs to high-precision manufacturing. In the PCBA processing process, relevant actual operating standards must be followed. If mistakes in actual operation will cause […]
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