Three factors causing soldering defects in PCB Circuit Board Assembly
1. Solderability of PCB Hole affects soldering quality Poor solderability of the circuit board holes will result in false soldering defects, which will affect the […]
Month: October 2021
How to reduce the Impedance Factor of PCB
The circuit performance provided by the printed circuit board must be able to prevent reflections during signal transmission, keep the signal intact, reduce transmission loss, […]
Heat dissipation mode of PCB circuit board
1.When there are a few devices in the PCB that diverge and conduct (three consecutive), a heat sink or a conductive tube can be added […]
Main points of double-sided PCB circuit board design
For PCB design novices, some design points need special attention. If you don’t pay attention, the designed PCB will probably not be put into use. […]
Characteristics of the Immersion Gold Process of PCB Surface Treatment
How important is the role of circuit boards in our lives? For us, almost everyone comes into contact with the circuit board every day, such […]
Manufacturing process of Multilayer PCB Circuit Board
With more and more functions of electronic products, the structure of PCB is becoming more and more complex. Due to the space limitation of PCB […]
3 methods of PCBA boards testing
AOI test, this test method is very common in PCBA processing, suitable for all PCBA processing, mainly through the shape characteristics of components to determine […]
Reflow soldering technology for SMT PCB Assembly
Reflow soldering, is a soldering technology developed with the advent of miniaturized electronic products, and is mainly used for soldering of various surface-mount components. The […]
The process of PCB SMT surface mount
The PCB SMT surface mount process consists of three main steps, solder paste printing, component placement, and reflow soldering. 1. Solder paste printing The solder […]
Prevent warpage of multilayer PCB boards during processing
1.Prevent the substrate from being warped due to improper inventory (1)Due to the increase in warpage of the copper clad laminate during storage, the moisture […]