
An Introduction of BGA Package
BGA (Ball Grid Array)-ball pin grid array packaging technology, high-density surface mount packaging technology. At the bottom of the package, the pins are spherical and […]
BGA (Ball Grid Array)-ball pin grid array packaging technology, high-density surface mount packaging technology. At the bottom of the package, the pins are spherical and […]
HDI is the English abbreviation of High Density Interconnector, that is, high-density interconnection board. It is a circuit board with a relatively high line distribution […]
The price of double sided PCB board is mainly composed of the following factors. 1. The cost of the board materials used is different. For […]
Tin spraying is one of the most commonly technology in PCB board. This process is practical. It has good soldering performance, good oxidation resistance, and […]
When printed circuit boards are inspected and tested, whether bare pcb boards or full-load assembly boards, once defects are detected. Cost-effective maintenance methods need to […]
PCB is an indispensable material for modern electronic products. With the rapid development of surface mount technology (SMT) and integrated circuit (IC) technology, PCB needs […]
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