An Introduction of BGA Package
BGA (Ball Grid Array)-ball pin grid array packaging technology, high-density surface mount packaging technology. At the bottom of the package, the pins are spherical and […]
Month: November 2021
An introduction of HDI PCB board
HDI is the English abbreviation of High Density Interconnector, that is, high-density interconnection board. It is a circuit board with a relatively high line distribution […]
Factors influencing the Price of Double sided PCB board
The price of double sided PCB board is mainly composed of the following factors. 1. The cost of the board materials used is different. For […]
Type of tin spray treatment on the surface of PCB board
Tin spraying is one of the most commonly technology in PCB board. This process is practical. It has good soldering performance, good oxidation resistance, and […]
Reprocessing and repairing of Double sided PCB board
When printed circuit boards are inspected and tested, whether bare pcb boards or full-load assembly boards, once defects are detected. Cost-effective maintenance methods need to […]
Analysis of the causes of poor soldering of OSP surface treatment PCB
PCB is an indispensable material for modern electronic products. With the rapid development of surface mount technology (SMT) and integrated circuit (IC) technology, PCB needs […]