Main points of double-sided PCB circuit board design
For PCB design novices, some design points need special attention. If you don’t pay attention, the designed PCB will probably not be put into use. […]
Characteristics of the Immersion Gold Process of PCB Surface Treatment
How important is the role of circuit boards in our lives? For us, almost everyone comes into contact with the circuit board every day, such […]
Manufacturing process of Multilayer PCB Circuit Board
With more and more functions of electronic products, the structure of PCB is becoming more and more complex. Due to the space limitation of PCB […]
3 methods of PCBA boards testing
AOI test, this test method is very common in PCBA processing, suitable for all PCBA processing, mainly through the shape characteristics of components to determine […]
Reflow soldering technology for SMT PCB Assembly
Reflow soldering, is a soldering technology developed with the advent of miniaturized electronic products, and is mainly used for soldering of various surface-mount components. The […]
The process of PCB SMT surface mount
The PCB SMT surface mount process consists of three main steps, solder paste printing, component placement, and reflow soldering. 1. Solder paste printing The solder […]
Prevent warpage of multilayer PCB boards during processing
1.Prevent the substrate from being warped due to improper inventory (1)Due to the increase in warpage of the copper clad laminate during storage, the moisture […]
Several simple PCB surface treatment methods
PCB surface treatment technology refers to form a layer that it is different from the mechanical, physical and chemical properties of the substrate on PCB […]
How to judge the quality of solder joints on PCBA?
In the process of PCBA smt, the solder joint quality of pcba board is very important. The solder joint quality will not only affect the […]
How to avoid solder paste defects in PCBA SMT processing
A variety of undesirable phenomena and production defects often occur in SMT chip processing, and many of these defects are caused by solder paste problems […]