The differences between single sided PCB boards, double sided PCB board and multilayer circuit board

The so-called single-sided PCB board and the double-sided PCB board have different copper layers. Double-sided has copper on both sides of the board, which can be connected through vias.However, there is only one layer of copper on one side, only simple circuits can be made, and the holes made can only be used for plug-in connections.

The single sided printed circuit board is usually made with copper foil laminate on one side, and the etching circuit pattern is made on the copper surface by screen printing or photolithography. The conductor pattern is formed by chemical etching to remove the excess copper foil.

The double-sided printed circuit board has two upper and lower conductor patterns, and the upper and lower through holes are connected by perforations.In the printed circuit board processing, the perforated hole wall is plated with a copper layer to make the upper and lower layers conductive.Double-sided printed circuit boards usually use double-sided copper clad laminates, and use screen printing or photoimaging to make corrosion-resistant circuit patterns on the copper surface.Excess copper foil is removed by chemical etching to form a conductor pattern.

The conductor pattern of the multilayer printed circuit board has three or more layers, and the conductor layer is divided into an inner layer and an outer layer. The inner layer is a conductor pattern completely sandwiched inside the multilayer board; the outer layer is a conductor pattern on the surface of the multilayer board. Generally, the inner conductor pattern is processed first during production, and the hole and the outer conductor pattern are processed after pressing, and the inner and outer layers are connected by metalized holes.

The production process of single-sided and double-sided PCB boards are basically similar, and the structure and production are relatively simple, while the multilayer circuit board is different, and the requirements for structural design and process production are very high.The higher the number of layers, the more difficult it is.